励福键合金线主要应用于半导体工业领域或芯片与外部电路的连接功能。励福键合金线在99.999％高纯金的基础上，通过适当的掺杂和合金，使金线能够满足不同封装领域的要求。
|
直径 |
重量 |
断裂负荷(g) |
延伸率 |
|
μm |
mil |
Mg/m |
KHl |
KM2 KM3 |
KL1 |
% |
|
15±1 |
0.6 |
2.97-3.88 |
>2.0 |
>2.5 |
>3.0 |
2.0-5.0 |
|
17±1 |
0.669 |
3.88-4.90 |
>3.0 |
>4.0 |
>5.0 |
2.0-6.0 |
|
18±1 |
0.7 |
4.35-5.48 |
>3.0 |
>4.0 |
>5.0 |
2.0-6.0 |
|
19±1 |
0.75 |
4.90-6.10 |
>4.0 |
>5.0 |
>6.0 |
2.0-6.0 |
|
20±1 |
0.8 |
5.48-6.70 |
>4.0 |
>5.0 |
>6.0 |
2.0-6.0 |
|
23±1 |
0.9 |
7.35-8.75 |
>6.0 |
>7.0 |
>8.0 |
2.0-8.0 |
|
24±1 |
0.944 |
8.02-9.48 |
>7.0 |
>8.0 |
>9.0 |
2.0-8.0 |
|
25±1 |
1.0 |
8.75-10.26 |
>8.0 |
>9.0 |
>10.0 |
2.0-8.0 |
|
28±1 |
1.1 |
11.05-12.75 |
>10.0 |
>12.0 |
>13.0 |
2.0-8.0 |
|
30±1 |
1.2 |
12.75-14.60 |
>12.0 |
>13.0 |
>15.0 |
3.0-10.0 |
|
32±1 |
1.25 |
14.60-16.50 |
>12.0 |
>15.0 |
>16.0 |
3.0-10.0 |
|
33±1 |
1.3 |
15.54-17.50 |
>14.0 |
>16.0 |
>18.0 |
3.0-10.0 |
|
35±1 |
1.4 |
17.50-19.65 |
>15.0 |
>18.0 |
>20.0 |
3.0-10.0 |
|
38±1 |
1.5 |
20.75-23.10 |
>18.0 |
>21.0 |
>23.0 |
3.0-10.0 |
|
40±1 |
1.6 |
23.10-25.50 |
>22.0 |
>24.0 |
>26.0 |
4.0-12.0 |
|
45±1 |
1.8 |
29.40-32.10 |
>26.0 |
>28.0 |
>30.0 |
4.0-12.0 |
|
50±1 |
2.0 |
34.90-41.00 |
>32.0 |
>35.0 |
>36.0 |
4.0-12.0 |
|
60±1 |
2.4 |
49.30-60.25 |
>48.0 |
>51.0 |
>53.0 |
8.0-15.0 |
|
70±1 |
2.8 |
68.10-80.85 |
>56.0 |
>60.0 |
>62.0 |
8.0-15.0 |
|
75±1 |
3 |
78.65-92.30 |
>66.0 |
>68.0 |
>72.0 |
8.0-15.0 | |
